Overview on Thermal and Mechanical Challenges of High Power RF Electronic Packaging

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Overview on Thermal and Mechanical Challenges of High Power RF Electronic Packaging

Journal Article (2011)

Author(s)

Cadmus Yuan (TU Delft - Electrical Engineering, Mathematics and Computer Science, TNO)

René Kregting (TNO)

Willem van Driel (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Sander Gielen (TNO)

An Xiao (NXP Semiconductors)

Guo Qi Zhang (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Research Group

Electronic Components, Technology and Materials

RF power packages Ceramic package Plastic high power packages Thermal and mechanical modeling Aluminum wires

DOI related publication

https://doi.org/10.4071/isom-2011-TP6-Paper4 Final published version

To reference this document use

https://resolver.tudelft.nl/uuid:4821769a-594a-40c3-904c-9cfaea198934

More Info

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Publication Year

2011

Language

English

Research Group

Electronic Components, Technology and Materials

Issue number

1

Volume number

2011

Pages (from-to)

418-429

Downloads counter

168

Abstract

High Power RF electronics is one of the essential parts for wireless communication, including the personal communication, broadcasting, microwave radar, etc. Moreover, high efficient high power electronics has entered the ISM market, such as the power generator of microwave oven.