Test Impact on the Overall Die-to-Wafer 3D Stacked IC Cost
Journal Article
(2011)
Author(s)
M. Taouil (TU Delft - Computer Engineering)
Said Hamdioui (TU Delft - Computer Engineering)
Kees Beenakker (TU Delft - Electronic Components, Technology and Materials)
E Marinissen (External organisation)
Research Group
Computer Engineering
To reference this document use:
https://resolver.tudelft.nl/uuid:0628e0a8-dc37-4ddc-80ec-48bcbe628b8d
More Info
expand_more
expand_more
Publication Year
2011
Language
English
Research Group
Computer Engineering
Issue number
10836
Pages (from-to)
1-11
No files available
Metadata only record. There are no files for this record.