Instruction Set Architecture (ISA) extensions, particularly scalar cryptography extensions (Zk), combine the performance advantages of hardware with the adaptability of software, enabling the direct and efficient execution of cryptographic functions within the processor pipeline. This integration eliminates the need to communicate with external cores, substantially reducing latency, power consumption, and hardware overhead, making it especially suitable for embedded systems with constrained resources. However, current scalar cryptography extension implementations remain vulnerable to physical threats, notably power side-channel attacks (PSCAs). These attacks allow adversaries to extract confidential information, such as secret keys, by analyzing the power consumption patterns of the hardware during operation. This paper presents an optimized and secure implementation of the RISC-V scalar Advanced Encryption Standard (AES) extension (Zkne/Zknd) using Domain-Oriented Masking (DOM) to mitigate first-order PSCAs. Our approach features optimized assembly implementations for partial rounds and key scheduling alongside pipeline-aware microarchitecture optimizations. We evaluated the security and performance of the proposed design using the Xilinx Artix7 FPGA platform. The results indicate that our design is side-channel-resistant while adding a very low area overhead of 0.39% to the full 32-bit CV32E40S RISC-V processor. Moreover, the performance overhead is zero when the extension-related instructions are properly scheduled.

Addressing non-idealities in Resistive Random Access Memories (RRAMs) is crucial for their successful commercialization. For example, the inherent resistance drift that occurs during consecutive read operations can induce Read Disturb Faults (RDF), leading to functional errors. This paper analyzes and characterizes the resistance drift and the RDF based on data measurements and presents a physics-based RRAM compact model that incorporates these non-idealities. Additionally, an in-field mitigation scheme is proposed, leveraging bidirectional read operations to balance the resistance. The scheme is implemented and validated through circuit simulations, both for RRAM used as memory and for RRAM-based computation-in-memory microarchitectures for deep neural networks. The results demonstrate that RRAM without any mitigation scheme can start failing after 8,000 consecutive reads, while our mitigation scheme ensures that the memory remains functional even after 10⁶ consecutive reads. Furthermore, the results indicate that using the MNIST dataset as a case study, the accuracy can drop significantly from 86% to as low as 12.5% without any mitigation scheme. In contrast, the proposed mitigation scheme improves this accuracy up to 84.2%.

Resistive Random-Access Memories (ReRAMs) represent a promising candidate to complement and/or replace CMOS-based memories adopted in several emerging applications. Despite all their advantages – mainly CMOS process compatibility, zero standby power, and high scalability and density – the use of ReRAMs in real applications depends on guaranteeing their quality after manufacturing. As observed in CMOS-based memories, ReRAMs are also susceptible to manufacturing deviations, including defects and process variations, that can cause faulty behaviors different from those observed in CMOS technology, increasing not only the manufacturing test complexity but also the time required to perform the test. In this context, this paper proposes to study the use of temperature to facilitate fault propagation in ReRAMs, reducing the required test time. A case study composed of a 3x3 word-based ReRAM with peripheral circuitry implemented based on a 130 nm Predictive Technology Model (PTM) library was adopted. During the proposed study, a total of 17 defects were injected in different positions of the ReRAM cell, and their respective faulty behavior was classified into conventional and unique faults, considering three different temperatures (25, 100, and -40 °C). The obtained results show that the temperature can, depending on the position of the defect, facilitate fault propagation, which reduces the time required for performing manufacturing testing.

In this paper, we introduce a novel passive physical anti-tampering Physical Unclonable Function (PUF) based on glitters that can protect an entire Integrated Circuit (IC) and/or Printable Circuit Board (PCB). A prototype of the proposed glitter based PUF has been developed. The glitters are dropped randomly in a resin layer during its formation and their positioning is used as the basis of a PUF. The PUF response is created by taking a picture inside the coating layer. To get a stable response resilient against noise and different temperature cycles, the picture is processed using filtering, image processing, and error correction. Using actual drill measurements, our findings indicate that even drilling with a 0.1mm diameter drill can be detected and lead to a wrong PUF response.

While Resistive RRAM (RRAM) provides appealing features for artificial neural networks (NN) such as low power operation and high density, its conductance variation can pose significant challenges for synaptic weight storage. This paper reports an experimental evaluation of the conductance variations of manufactured RRAMs memory cells at the memory array level. Variability is evaluated with respect to the RRAM low resistance state (LRS) and high resistance state (HRS) conductance ratio. This ratio is selected as the parameter of interest as it guarantees the proper operation of the RRAM: the larger the ratio, the more reliable and robust the RRAM cell is in storing and retrieving data. The measurement results show that conductance ratio is significantly influenced by variability. Using these findings, the performance of an artificial neural network that uses individual RRAM cells for synaptic weight storage is evaluated in relation to conductance variability. It is shown that RRAM variability can heavily affect the network behavior, resulting in a substantial decrease in the classification accuracy during inference.

The IEEE European Test Symposium (ETS) has been facilitating progress in electronic systems testing since its launch in 1996. On the occasion of its 30th anniversary, this collaborative paper gathers sections by 21 ETS teams to outline their influential ideas and milestones. Each team's section highlights historical perspective, current research, frameworks and projects as well as forward-looking research agendas in the area of electronic-based circuits and systems testing, reliability, safety, security and validation. This anniversary summary documents how research of various ETS teams, exemplifying the test community, has been evolving and transitioning from concepts to practical standards and Electronic Design Automation (EDA) tools and flows. This legacy is a strong base to drive the next generation of advances in electronic systems testing.

Resistive RAM (RRAM) design optimization and error monitoring is crucial for memory storage applications but also to enable future brain-inspired systems beyond the capabilities of today’s hardware. The figure-of-merit confirming the presence of resistive switching in RRAM devices is its resistance window expressed by the HRS/LRS ratio (High Resistance State over the Low Resistance State). This ratio guarantees the proper operation of the RRAM: the larger the ratio, the more reliable and robust the RRAM cell becomes in storing and retrieving data. From this perspective, this paper proposes an analysis of RRAM intermittent errors with respect to the RRAM resistance ratio. The impact of intermittent errors on the HRS/LRS ratio is analyzed at the RRAM cell electrical level using a dedicated test chip. Silicon measurements show that all detected RRAM intermittent errors directly result from resistance drifts due to ineffective programming operations. In view of these findings, intermittent error mitigation schemes are proposed to address these errors at the circuit level.

Ferroelectric Field-Effect Transistors (FeFETs) are promising candidates for non-volatile memory (NVM) technologies, especially in embedded systems and edge computing. However, due to their physical characteristics, FeFETs exhibit unique defects—such as Threshold Voltage Shifting (TVS) caused by trap charges in the oxide layer—that are not captured by conventional defect models. This study adopts the Device-Aware Test (DAT) methodology to model these defects by incorporating their impact into the electrical parameters, calibrated using measurement data. Defect injection, circuit-level simulations, and fault analysis are performed to derive realistic fault models. Finally, the March algorithm and Design-for-Test (DfT) techniques are proposed to effectively detect these defects.

With the rise of energy-constrained smart edge applications, there is a pressing need for energy-efficient computing engines that process generated data locally, at least for small and medium-sized applications. To address this issue, this paper proposes DREAM-CIM, a digital SRAM-based computation-in-memory (CIM) accelerator. It targets an energy- and area-efficient implementation of the multiply-and-accumulate (MAC) operation, which is the core operation of neural networks. The accelerator is based on a multi-sub-array macro to increase parallelism, integrates multiplication operations within the memory cells such that they are executed while reading the cells, makes use of pipelining to further optimize the throughput of the MAC operations, and gets rid of the expensive adder-tree structures commonly used in State-of-The-Art (SOTA) digital CIM solutions by replacing them with a custom accumulation circuit to reduce power and area. The SPICE simulation results of the DREAM-CIM accelerator show an energy efficiency of 5097 TOPS/W (normalized to a 1-bit × 1-bit MAC operation) and an area efficiency of 3854 TOPS/mm$^2$ using 22 nm technology node.
The obtained circuit-level results were fed into a python-based system-level simulator to benchmark the system architecture using two applications, i.e., image classification (using MNIST and CIFAR-10 dataset on LeNet5 and Resnet-20 models) and object detection (using COCO dataset on the YoloV6 model). The system-level results show that DREAM-CIM can achieve an energy efficiency of 0.1mJ, 0.2mJ, and 11.02mJ per inference for the MNIST, YOLOv6, and CIFAR-10 datasets, respectively, while maintaining SOTA accuracy.

Structural testing has been very successful in the VLSI manufacturing process to screen out faulty devices and provide high outgoing product quality. However, recent reported data show that existing solutions are not good enough for advanced technology nodes and emerging device technologies. This paper discusses a new manufacturing test approach called DeviceAware Test (DAT), applies it to different flavors of emerging devices, and its potential to be used beyond just manufacturing test.

The development of Ferroelectric Field-Effect Transistor (FeFET) manufacturing requires high-quality test solutions, yet research on FeFET testing is still in a nascent stage. To generate a dedicated test method for FeFETs, it is critical to have a deep understanding of manufacturing defects and accurately model them. In this work, we introduce the unique defect, Anomalous Charge Trapping (ACT), in FeFETs. The ACT-defective FeFET is characterized, and the physical mechanism of the defect is explained. Then, we apply the Deviceaware Test (DAT) method to design a specific ACT-defective FeFET model, which includes the physical impact of the defect on the electrical parameters of defect-free models, and calibrate the model with measurement data. Fault modeling is performed based on circuit-level simulations, and dedicated test solutions are proposed.

With the increasing demand for energy-efficient solutions in smart edge applications, there is a pressing need for computing architectures that can effectively manage di-verse and computation-intensive workloads. To address this, we propose APX-DREAM-CIM, an approximate digital SRAM-based Computation-In-Memory (CIM) accelerator specifically designed to maximize energy and area efficiency with minimal impact on accuracy by investigating cross-layer optimizations. The architecture uses, on the one hand, quantized models and, on the other hand, integrates a range of approximate adder designs, each offering distinct trade-offs between hard-ware efficiency and computational precision. To further enhance resilience to approximation-induced errors, we introduce a novel Approximate-Aware Training (AAT) methodology, which models the approximate behavior of the hardware during training, enabling the network to adapt accordingly. We evaluate APX-DREAM-CIM using the MNIST and CIFAR-10 datasets with LeNet-5 and ResNet-20 topologies. Experimental results show that APX-DREAM-CIM achieves up to 17% energy and 16% area reduction compared to the exact baseline architecture. Moreover, AAT enables the system to retain, and in some cases, even exceed, the accuracy of standard quantized models.

Compute-in-memory (CIM) AI accelerators using non-volatile memories like RRAM enable energy-efficient edge inference by executing Multiply-Accumulate (MAC) operations directly in memory in a single cycle. These designs modify memory cells and analog-to-digital converters (ADCs), introducing faults not seen in standard memories. We present the first structural testing methodology and framework for RRAM-based CIM MAC circuits, including defect and fault models for memory cells and ADCs. Our robust inference-driven tests exercise full MAC functionality, significantly reducing test time compared to traditional methods, and integrating cell and peripheral testing to ensure high reliability, defect coverage, and operational efficiency.

Edge AI accelerators have revolutionized intelligent information processing, enabling applications, such as self-driving cars and low-power IoT devices. Design efforts prioritize computational power and energy efficiency. Nevertheless, testability is also critical for in-field, reliable operation, especially for novel architectures such as memristive, analog Computation-in-Memory (CIM) cores. These structures combine emerging Resistive Random Access Memory (RRAM) with CMOS peripherals to efficiently implement vector-matrix-multiplication (VMM) operations for inference. Current research on AI Accelerator testing relies on functional test patterns, derived from abstract and unrealistic fault models. This paper presents a novel structural testing methodology for CIM VMM circuits. The methodology utilizes device-level defect models and defines new fault models for CIM VMM. The resulting test patterns are optimized to maximize defect coverage and minimize test time, since they require only a single write operation per victim cell.

SRAM Physical Unclonable Functions (PUFs) serve as security primitives and can be used to generate random and unique identifiers, which makes their reliability crucial. The reliability is affected by aging and in particular Bias Temperature Instability (BTI), which in turn affects the PUF responses over time typically measured by the Hamming distance (HD). In this work, we model the BTI impact on SRAM PUF reliability for 14 nm FinFET technology and evaluate the reliability of SRAM PUFs using both simulation and silicon measurements. Additionally, we explore the effectiveness of an anti-aging technique on SRAM PUF reliability. Our simulation model and results (which include process variation and circuit noise) are validated with silicon measurements. From them we conclude the following: 1) there exists a direct correlation between BTI and the Hamming distance of an SRAM PUF, where its reliability decreases with 6% over a 6-month period due to aging, and 2) applying anti-aging patterns improves the Hamming distance and hence the reliability with 3% over a 6-month period.

The Spin-Transfer Torque Magnetic Random Access Memory (STT-MRAM) is on its way to commercialization. However, the development of high-quality test solutions for STT-MRAMs poses challenges due to the specific working mechanism of the core element of the STT-MRAM bit cells, i.e., the magnetic tunnel junction (MTJ), which involves both a magnetic field and spin-transfer torque. This property can introduce defects unique to MTJs which may escape from test programs that consist solely of functional write and read operations, like march tests. Hence, it is important to develop test solutions that go beyond conventional march tests. This paper explores the effect of applying an external magnetic field (H_ext) on the test quality and test time of STT-MRAMs, which could be achieved by integrating one or more magnets in the Automated Test Equipment (ATE) setup. A framework for these so-called H_ext-assisted tests is presented and implemented for all known conventional and unique defects. The paper demonstrates that the H_ext-assisted tests offer superior coverage and/or lower test time compared to regular functional tests, like march tests. The effectiveness of these tests are validated through silicon measurements.

Resistive Random-Access Memories (ReRAMs) represent a promising candidate to complement and/or replace CMOS-based memories used in several emerging applications. Despite all the advantages of using these novel memories, mainly due to the memristive device's CMOS manufacturing process compatibility, zero standby power consumption, as well as, high scalability and density, the use of them in real applications depends on being able to guarantee their quality after manufacturing. As observed in CMOS-based memories, ReRAMs are also susceptible to manufacturing deviations, defects, and process variations, that can cause faulty behaviors different from the ones observed in CMOS technology, increasing not only the manufacturing test complexity but also the time required to perform the test. In this context, this paper proposes to study the use of temperature to facilitate fault propagation in ReRAMs, reducing the required test time. A case study composed of a 3x3 word-based ReRAM with peripheral circuitry implemented based on a 130 nm Predictive Technology Model (PTM) library was adopted. During the proposed study, a total of 17 defects were injected in different positions of the ReRAM cell, and their respective faulty behavior was classified into traditional and unique faults, considering three temperatures (25, 100, and -40°C). The obtained results show that the temperature can, depending on the position of the defect, facilitate fault propagation, which reduces the time required for performing manufacturing testing.

As electronics and software become more integrated into automobiles, Functional Safety (FuSa) per ISO 26262 becomes important. It assesses the risk level of automotive chips, reflected by the Automotive Safety Integrity Level (ASIL). Fault injection simulation verifies the FuSa of a design by injecting faults and classifying them based on whether safety mechanisms detect them. Discrepancies in classification results from FuSa EDA tools can lead to varying ASIL assignments and misrepresent associated risk. Thus, we evaluate two FuSa EDA tools, Cadence® XFS and Synopsys® VC Z01X, for RTL designs. We find that the fault space covered by the tools is not complete. Hence, we propose a novel verification methodology combining both tools to achieve maximum fault space coverage. We apply this approach to the AutoSoC benchmark suite and achieve a more accurate Diagnostic Coverage (DC) of 97.79%, over the baseline verification methodology of 98.36%, at the cost of injecting 1.31 times more faults. Our work ensures that the correct ASIL level is assigned through accurate DC estimation.

While Resistive RRAM (RRAM) offers attractive features for artificial neural networks (NN) such as low power operation and high-density, its conductance variation can pose significant challenges when the storage of synaptic weights is concerned. This paper reports an experimental evaluation of the conductance variations of manufactured RRAMs at the memory array level. Working at the memory array level allows to catch cycle-to-cycle (C2C) as well as device-to-device (D2D) variability and, hence, to propose a realistic evaluation of the conductance variation. Variability is evaluated with respect to the RRAM low resistance state (LRS) and high resistance state (HRS) conductance ratio. This ratio is selected as the parameter of interest as it guarantees the proper operation of the RRAM: the larger the ratio, the more reliable and robust the RRAM cell is in storing and retrieving data. The measurement results show that the conductance ratio is heavily affected by variability. Large spatial and temporal variations are reported, making challenging RRAM-based analog weight storage.

Resistive Random Access Memories (RRAMs) are now undergoing commercialization, with substantial investment from many semiconductor companies. However, due to the immature manufacturing process, RRAMs are prone to exhibit unique defects, which should be efficiently identified for high-volume production. Hence, obtaining diagnostic solutions for RRAMs is necessary to facilitate yield learning, and improve RRAM quality. Recently, the Device-Aware Test (DAT) approach has been proposed as an effective method to detect unique defects in RRAMs. However, the DAT focuses more on developing defect models to aid production testing but does not focus on the distinctive features of defects to diagnose different defects. This paper proposes a Device-Aware Diagnosis method; it is based on the DAT approach, which is extended for diagnosis. The method aims to efficiently distinguish unique defects and conventional defects based on their features. To achieve this, we first define distinctive features of each defect based on physical analysis and characterizations. Then, we develop efficient diagnosis algorithms to extract electrical features and fault signatures for them. The simulation results show the effectiveness of the developed method to reliably diagnose all targeted defects.