Instruction Set Architecture (ISA) extensions, particularly scalar cryptography extensions (Zk), combine the performance advantages of hardware with the adaptability of software, enabling the direct and efficient execution of cryptographic functions within the processor pipeline. This integration eliminates the need to communicate with external cores, substantially reducing latency, power consumption, and hardware overhead, making it especially suitable for embedded systems with constrained resources. However, current scalar cryptography extension implementations remain vulnerable to physical threats, notably power side-channel attacks (PSCAs). These attacks allow adversaries to extract confidential information, such as secret keys, by analyzing the power consumption patterns of the hardware during operation. This paper presents an optimized and secure implementation of the RISC-V scalar Advanced Encryption Standard (AES) extension (Zkne/Zknd) using Domain-Oriented Masking (DOM) to mitigate first-order PSCAs. Our approach features optimized assembly implementations for partial rounds and key scheduling alongside pipeline-aware microarchitecture optimizations. We evaluated the security and performance of the proposed design using the Xilinx Artix7 FPGA platform. The results indicate that our design is side-channel-resistant while adding a very low area overhead of 0.39% to the full 32-bit CV32E40S RISC-V processor. Moreover, the performance overhead is zero when the extension-related instructions are properly scheduled.

Vector–matrix multiplication (VMM), implemented through multiply–accumulate (MAC) operations, represents the dominant computational primitive in many artificial intelligence (AI) workloads. When executed on conventional von Neumann architectures, VMM operations suffer from important energy consumption and latency due to the separation between memory and processing units. To overcome these limitations, crossbar arrays built from Resistive Random Access Memory (RRAM) cells have been proposed for accelerating VMM computations. In this work, we investigate the key optimization trade-offs associated with implementing RRAM-based neural networks for classification applications. A simple two-layer neural network is first defined and trained in software to generate the weight matrices and bias parameters. Next, three hardware implementation scenarios are evaluated depending on whether negative floating-point numbers are used: Positive Weights Only (PWO), Positive and Negative Weights Only (PNWO), and Positive and Negative Weights with Biases (PNWB). The different implementations are analyzed at the hardware level by examining classification accuracy, energy efficiency, latency, and area overhead. The study further incorporates important RRAM limitations, including restricted conductance range and device variability. Hardware results show that the PWO scenario offers the lowest energy consumption (189 fJ/MAC) and area overhead but results in the lowest accuracy. PNWO and PNWB significantly improve accuracy (+177% and +180%) but increase energy consumption (+63% and +87%) and area (×2 and ×2.1). Under variability effects, PWO achieves better accuracy (94.65%), followed by PNWO (93.11%) and PNWB (92.11%).

Physics-based compact models for emerging non-volatile memories (NVMs) are often limited by the complex interactions of microscopic domains and defects that are difficult to capture analytically, resulting in reduced accuracy and simulation efficiency. To address this challenge, a machine learning (ML)-based approach is proposed using artificial neural networks (ANNs) trained entirely on device measurement data, enabling a direct translation of fabrication characteristics into SPICE-compatible circuit models. The resulting models achieve high accuracy (MSE: 0.724, adjusted R² : 0.998), significantly outperforming physics-based baselines with an 18× lower MSE for polarization and a two-order-of-magnitude precision improvement in FeFET current simulation, while accurately capturing the wake-up process. Furthermore, the model demonstrates robust out-of-distribution (OOD) extrapolation to unseen ferroelectric thicknesses and a 33.7% improvement in simulation speed. These results validate the ML-based approach as a highly efficient, SPICE-compatible solution for next-generation memory.

Addressing non-idealities in Resistive Random Access Memories (RRAMs) is crucial for their successful commercialization. For example, the inherent resistance drift that occurs during consecutive read operations can induce Read Disturb Faults (RDF), leading to functional errors. This paper analyzes and characterizes the resistance drift and the RDF based on data measurements and presents a physics-based RRAM compact model that incorporates these non-idealities. Additionally, an in-field mitigation scheme is proposed, leveraging bidirectional read operations to balance the resistance. The scheme is implemented and validated through circuit simulations, both for RRAM used as memory and for RRAM-based computation-in-memory microarchitectures for deep neural networks. The results demonstrate that RRAM without any mitigation scheme can start failing after 8,000 consecutive reads, while our mitigation scheme ensures that the memory remains functional even after 10⁶ consecutive reads. Furthermore, the results indicate that using the MNIST dataset as a case study, the accuracy can drop significantly from 86% to as low as 12.5% without any mitigation scheme. In contrast, the proposed mitigation scheme improves this accuracy up to 84.2%.

The development of Ferroelectric Field-Effect Transistor (FeFET) manufacturing requires high-quality test solutions, yet research on FeFET testing is still in a nascent stage. To generate a dedicated test method for FeFETs, it is critical to have a deep understanding of manufacturing defects and accurately model them. In this work, we introduce the unique defect, Anomalous Charge Trapping (ACT), in FeFETs. The ACT-defective FeFET is characterized, and the physical mechanism of the defect is explained. Then, we apply the Deviceaware Test (DAT) method to design a specific ACT-defective FeFET model, which includes the physical impact of the defect on the electrical parameters of defect-free models, and calibrate the model with measurement data. Fault modeling is performed based on circuit-level simulations, and dedicated test solutions are proposed.

Compute-in-memory (CIM) AI accelerators using non-volatile memories like RRAM enable energy-efficient edge inference by executing Multiply-Accumulate (MAC) operations directly in memory in a single cycle. These designs modify memory cells and analog-to-digital converters (ADCs), introducing faults not seen in standard memories. We present the first structural testing methodology and framework for RRAM-based CIM MAC circuits, including defect and fault models for memory cells and ADCs. Our robust inference-driven tests exercise full MAC functionality, significantly reducing test time compared to traditional methods, and integrating cell and peripheral testing to ensure high reliability, defect coverage, and operational efficiency.

Structural testing has been very successful in the VLSI manufacturing process to screen out faulty devices and provide high outgoing product quality. However, recent reported data show that existing solutions are not good enough for advanced technology nodes and emerging device technologies. This paper discusses a new manufacturing test approach called DeviceAware Test (DAT), applies it to different flavors of emerging devices, and its potential to be used beyond just manufacturing test.

Ferroelectric Field-Effect Transistors (FeFETs) are promising candidates for non-volatile memory (NVM) technologies, especially in embedded systems and edge computing. However, due to their physical characteristics, FeFETs exhibit unique defects—such as Threshold Voltage Shifting (TVS) caused by trap charges in the oxide layer—that are not captured by conventional defect models. This study adopts the Device-Aware Test (DAT) methodology to model these defects by incorporating their impact into the electrical parameters, calibrated using measurement data. Defect injection, circuit-level simulations, and fault analysis are performed to derive realistic fault models. Finally, the March algorithm and Design-for-Test (DfT) techniques are proposed to effectively detect these defects.

SRAM Physical Unclonable Functions (PUFs) serve as security primitives and can be used to generate random and unique identifiers, which makes their reliability crucial. The reliability is affected by aging and in particular Bias Temperature Instability (BTI), which in turn affects the PUF responses over time typically measured by the Hamming distance (HD). In this work, we model the BTI impact on SRAM PUF reliability for 14 nm FinFET technology and evaluate the reliability of SRAM PUFs using both simulation and silicon measurements. Additionally, we explore the effectiveness of an anti-aging technique on SRAM PUF reliability. Our simulation model and results (which include process variation and circuit noise) are validated with silicon measurements. From them we conclude the following: 1) there exists a direct correlation between BTI and the Hamming distance of an SRAM PUF, where its reliability decreases with 6% over a 6-month period due to aging, and 2) applying anti-aging patterns improves the Hamming distance and hence the reliability with 3% over a 6-month period.

Edge AI accelerators have revolutionized intelligent information processing, enabling applications, such as self-driving cars and low-power IoT devices. Design efforts prioritize computational power and energy efficiency. Nevertheless, testability is also critical for in-field, reliable operation, especially for novel architectures such as memristive, analog Computation-in-Memory (CIM) cores. These structures combine emerging Resistive Random Access Memory (RRAM) with CMOS peripherals to efficiently implement vector-matrix-multiplication (VMM) operations for inference. Current research on AI Accelerator testing relies on functional test patterns, derived from abstract and unrealistic fault models. This paper presents a novel structural testing methodology for CIM VMM circuits. The methodology utilizes device-level defect models and defines new fault models for CIM VMM. The resulting test patterns are optimized to maximize defect coverage and minimize test time, since they require only a single write operation per victim cell.

Resistive RAM (RRAM) design optimization and error monitoring is crucial for memory storage applications but also to enable future brain-inspired systems beyond the capabilities of today’s hardware. The figure-of-merit confirming the presence of resistive switching in RRAM devices is its resistance window expressed by the HRS/LRS ratio (High Resistance State over the Low Resistance State). This ratio guarantees the proper operation of the RRAM: the larger the ratio, the more reliable and robust the RRAM cell becomes in storing and retrieving data. From this perspective, this paper proposes an analysis of RRAM intermittent errors with respect to the RRAM resistance ratio. The impact of intermittent errors on the HRS/LRS ratio is analyzed at the RRAM cell electrical level using a dedicated test chip. Silicon measurements show that all detected RRAM intermittent errors directly result from resistance drifts due to ineffective programming operations. In view of these findings, intermittent error mitigation schemes are proposed to address these errors at the circuit level.

With the rise of energy-constrained smart edge applications, there is a pressing need for energy-efficient computing engines that process generated data locally, at least for small and medium-sized applications. To address this issue, this paper proposes DREAM-CIM, a digital SRAM-based computation-in-memory (CIM) accelerator. It targets an energy- and area-efficient implementation of the multiply-and-accumulate (MAC) operation, which is the core operation of neural networks. The accelerator is based on a multi-sub-array macro to increase parallelism, integrates multiplication operations within the memory cells such that they are executed while reading the cells, makes use of pipelining to further optimize the throughput of the MAC operations, and gets rid of the expensive adder-tree structures commonly used in State-of-The-Art (SOTA) digital CIM solutions by replacing them with a custom accumulation circuit to reduce power and area. The SPICE simulation results of the DREAM-CIM accelerator show an energy efficiency of 5097 TOPS/W (normalized to a 1-bit × 1-bit MAC operation) and an area efficiency of 3854 TOPS/mm$^2$ using 22 nm technology node.
The obtained circuit-level results were fed into a python-based system-level simulator to benchmark the system architecture using two applications, i.e., image classification (using MNIST and CIFAR-10 dataset on LeNet5 and Resnet-20 models) and object detection (using COCO dataset on the YoloV6 model). The system-level results show that DREAM-CIM can achieve an energy efficiency of 0.1mJ, 0.2mJ, and 11.02mJ per inference for the MNIST, YOLOv6, and CIFAR-10 datasets, respectively, while maintaining SOTA accuracy.

The IEEE European Test Symposium (ETS) has been facilitating progress in electronic systems testing since its launch in 1996. On the occasion of its 30th anniversary, this collaborative paper gathers sections by 21 ETS teams to outline their influential ideas and milestones. Each team's section highlights historical perspective, current research, frameworks and projects as well as forward-looking research agendas in the area of electronic-based circuits and systems testing, reliability, safety, security and validation. This anniversary summary documents how research of various ETS teams, exemplifying the test community, has been evolving and transitioning from concepts to practical standards and Electronic Design Automation (EDA) tools and flows. This legacy is a strong base to drive the next generation of advances in electronic systems testing.

While Resistive RRAM (RRAM) provides appealing features for artificial neural networks (NN) such as low power operation and high density, its conductance variation can pose significant challenges for synaptic weight storage. This paper reports an experimental evaluation of the conductance variations of manufactured RRAMs memory cells at the memory array level. Variability is evaluated with respect to the RRAM low resistance state (LRS) and high resistance state (HRS) conductance ratio. This ratio is selected as the parameter of interest as it guarantees the proper operation of the RRAM: the larger the ratio, the more reliable and robust the RRAM cell is in storing and retrieving data. The measurement results show that conductance ratio is significantly influenced by variability. Using these findings, the performance of an artificial neural network that uses individual RRAM cells for synaptic weight storage is evaluated in relation to conductance variability. It is shown that RRAM variability can heavily affect the network behavior, resulting in a substantial decrease in the classification accuracy during inference.

In this paper, we introduce a novel passive physical anti-tampering Physical Unclonable Function (PUF) based on glitters that can protect an entire Integrated Circuit (IC) and/or Printable Circuit Board (PCB). A prototype of the proposed glitter based PUF has been developed. The glitters are dropped randomly in a resin layer during its formation and their positioning is used as the basis of a PUF. The PUF response is created by taking a picture inside the coating layer. To get a stable response resilient against noise and different temperature cycles, the picture is processed using filtering, image processing, and error correction. Using actual drill measurements, our findings indicate that even drilling with a 0.1mm diameter drill can be detected and lead to a wrong PUF response.

With the increasing demand for energy-efficient solutions in smart edge applications, there is a pressing need for computing architectures that can effectively manage di-verse and computation-intensive workloads. To address this, we propose APX-DREAM-CIM, an approximate digital SRAM-based Computation-In-Memory (CIM) accelerator specifically designed to maximize energy and area efficiency with minimal impact on accuracy by investigating cross-layer optimizations. The architecture uses, on the one hand, quantized models and, on the other hand, integrates a range of approximate adder designs, each offering distinct trade-offs between hard-ware efficiency and computational precision. To further enhance resilience to approximation-induced errors, we introduce a novel Approximate-Aware Training (AAT) methodology, which models the approximate behavior of the hardware during training, enabling the network to adapt accordingly. We evaluate APX-DREAM-CIM using the MNIST and CIFAR-10 datasets with LeNet-5 and ResNet-20 topologies. Experimental results show that APX-DREAM-CIM achieves up to 17% energy and 16% area reduction compared to the exact baseline architecture. Moreover, AAT enables the system to retain, and in some cases, even exceed, the accuracy of standard quantized models.

Resistive Random-Access Memories (ReRAMs) represent a promising candidate to complement and/or replace CMOS-based memories adopted in several emerging applications. Despite all their advantages – mainly CMOS process compatibility, zero standby power, and high scalability and density – the use of ReRAMs in real applications depends on guaranteeing their quality after manufacturing. As observed in CMOS-based memories, ReRAMs are also susceptible to manufacturing deviations, including defects and process variations, that can cause faulty behaviors different from those observed in CMOS technology, increasing not only the manufacturing test complexity but also the time required to perform the test. In this context, this paper proposes to study the use of temperature to facilitate fault propagation in ReRAMs, reducing the required test time. A case study composed of a 3x3 word-based ReRAM with peripheral circuitry implemented based on a 130 nm Predictive Technology Model (PTM) library was adopted. During the proposed study, a total of 17 defects were injected in different positions of the ReRAM cell, and their respective faulty behavior was classified into conventional and unique faults, considering three different temperatures (25, 100, and -40 °C). The obtained results show that the temperature can, depending on the position of the defect, facilitate fault propagation, which reduces the time required for performing manufacturing testing.

Due to the immature manufacturing process, Resistive Random Access Memories (RRAMs) are prone to exhibit new failure mechanisms and faults, which should be efficiently detected for high-volume production. Those unique faults are hard to detect but require specific Design-for-Test (DfT) circuit design. This paper proposes a DfT based on a parallel-reference write circuit that can detect all RRAM array faults during diagnosis, production testing, and its application in the field.

Modern DRAMs are vulnerable to Rowhammer attacks, demanding robust protection methods to mitigate these attacks. Existing solutions aim at increased resilience by improving design and/or adjusting operation parameters, limit row access count by throttling and prevent bit flips by timely row refreshing. However, scaling these methods for future DRAM technologies may incur significant costs in terms of area, power and/or latency. This study analyses the impact of the values of the neighbouring cells on victim cells and introduces a row alternation protection method, which is a novel approach that alternates the data of attacker rows on each access to lower the chance of bit flips in victim rows. Our analysis show that the minimum Rowhammer count to cause a bitflip in a particular cell does not only depend on vertical neighbours from the attacker row, but also on the value of the horizontal neighbours from the victim row as well as diagonal cells from the attacker row. Row alternation is able to protect the majority of the vulnerable cells (i.e., with 65%) for the DRAM used in our case study and in cases where unsuccessful it significantly increases the average minimum required Rowhammer account by 18%.

As emerging non-volatile memory (NVM) devices, Ferroelectric Field-Effect Transistors (FeFETs) present distinctive opportunities for the design of ultra-dense and low-leakage memory systems. For matured FeFET manufacturing, it is extremely important to have an understanding of manufacturing defects and accurately model them to develop effective test solutions. This paper introduces a comprehensive framework for defect and fault modeling, which enables the development of test solutions. First, a classification of FeFET manufacturing defects is provided; both conventional defects (such as contacts and interconnect defects) as well as unique FeFET defects are discussed. The latter FeFET specific defect leads to unique faults that cannot be adequately described using traditional modeling approaches. Then, the Device-Aware Test (DAT) method is used to effectively and appropriately model, analyze and develop test solutions for such unique defects; the approach will be illustrated for Stuck-at-Polarization (SAP) defects.