Polymer-based 2D/3D wafer level heterogeneous integration for SSL module
Conference Paper
(2012)
Author(s)
Cadmus Yuan (TU Delft - Electronic Components, Technology and Materials)
J. Wei (TU Delft - Electronic Components, Technology and Materials)
Huai-Yu Ye (TU Delft - Electronic Components, Technology and Materials)
SW Koh (TU Delft - Electronic Components, Technology and Materials)
S Harianto (External organisation)
M van den Nieuwenhof (External organisation)
Guo Qi Zhang (TU Delft - Electronic Components, Technology and Materials)
Research Group
Electronic Components, Technology and Materials
DOI related publication
https://doi.org/10.1109/ESimE.2012.6191808
To reference this document use:
https://resolver.tudelft.nl/uuid:0aeebfcb-c305-433c-b1d8-132c58775236
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Publication Year
2012
Language
English
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
712-718
ISBN (print)
978-1-4673-1512-8
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