Front-to back-side overlay optimization after wafer bonding for 3D integration

Conference Paper (2005)
Author(s)

WD van Noort (TU Delft - Electronic Components, Technology and Materials)

L Marinier (External organisation)

R Pellens (External organisation)

B Sutedja (External organisation)

R. Dekker (External organisation)

Henk W. Van Zeijl (TU Delft - Electronic Components, Technology and Materials)

Research Group
Electronic Components, Technology and Materials
More Info
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Publication Year
2005
Research Group
Electronic Components, Technology and Materials
Bibliographical Note
Editors & ISBN onbekend@en
Pages (from-to)
1-4

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