Front-to back-side overlay optimization after wafer bonding for 3D integration
Conference Paper
(2005)
Author(s)
WD van Noort (TU Delft - Electronic Components, Technology and Materials)
L Marinier (External organisation)
R Pellens (External organisation)
B Sutedja (External organisation)
R. Dekker (External organisation)
HW van Zeijl (TU Delft - Electronic Components, Technology and Materials)
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https://resolver.tudelft.nl/uuid:0b773c45-f631-40c0-a76c-b7df5553d565
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Publication Year
2005
Bibliographical Note
Editors & ISBN onbekend
Pages (from-to)
1-4
Publisher
Elsevier
Event
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