Low-temperature bottom-up integration of carbon nanotubes for vertical interconnects in monolithic 3D integrated circuits

Conference paper (2012)

Authors

S. Vollebregt Electronic Components, Technology and Materials -

R. Ishihara Electronic Components, Technology and Materials -

J. van der Cingel Electronic Components, Technology and Materials -

C.I.M. Beenakker Electronic Components, Technology and Materials -

Research Group

Electronic Components, Technology and Materials () (TU Delft)

More Info

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http://resolver.tudelft.nl/uuid:0d6512d9-10bb-4076-9346-90e1edb171fc

Published Date

2012

Language

English

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials