Low-temperature bottom-up integration of carbon nanotubes for vertical interconnects in monolithic 3D integrated circuits
Conference Paper
(2012)
Author(s)
S Vollebregt (TU Delft - Electronic Components, Technology and Materials)
R Ishihara (TU Delft - Electronic Components, Technology and Materials)
J. van der Cingel (TU Delft - Electronic Components, Technology and Materials)
C.I.M. Beenakker (TU Delft - Electronic Components, Technology and Materials)
Research Group
Electronic Components, Technology and Materials
DOI related publication
https://doi.org/10.1109/3DIC.2012.6262989
To reference this document use:
https://resolver.tudelft.nl/uuid:0d6512d9-10bb-4076-9346-90e1edb171fc
More Info
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Publication Year
2012
Language
English
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
1-4
ISBN (print)
978-1-4673-2189-1
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