Wafer-level packaging for RF applications using high-resistivity polycrystalline silicon substrate technology
Conference Paper
(2004)
Author(s)
A Poliakov (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
SM Sinaga (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
M. Bartek (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
JN Burghartz (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
Research Group
Old - EWI Ch. Integrated Sensing Devices
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https://resolver.tudelft.nl/uuid:0fa0c35b-a7de-494e-bb41-ce695eb46c88
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Publication Year
2004
Research Group
Old - EWI Ch. Integrated Sensing Devices
Pages (from-to)
1-8
ISBN (print)
0-930815-74-2
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