How significant will be the test cost share for 3D Die-to-Wafer stacked-ICs?
Conference Paper
(2011)
Author(s)
M. Taouil (TU Delft - Computer Engineering)
S. Hamdioui (TU Delft - Computer Engineering)
E Marinissen (External organisation)
Research Group
Computer Engineering
DOI related publication
https://doi.org/10.1109/DTIS.2011.5941432
To reference this document use:
https://resolver.tudelft.nl/uuid:15d77c65-28e7-43fb-8e76-ed40c1fd2902
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Publication Year
2011
Language
English
Research Group
Computer Engineering
Pages (from-to)
1-6
ISBN (print)
978-1-61284-899-0
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