Multiscale Experimental Investigation of Electromigration Failure in Al &amp; Cu Interconnects

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doi:10.4233/uuid:1f147f76-5415-4d1d-8b2e-9be18c2cd26c

Multiscale Experimental Investigation of Electromigration Failure in Al & Cu Interconnects

Doctoral Thesis (2025)

Author(s)

Y. Zhang (TU Delft - Electronic Components, Technology and Materials)

Contributor(s)

Kouchi Zhang – Promotor (TU Delft - Electronic Components, Technology and Materials)

S. Vollebregt – Promotor (TU Delft - Electronic Components, Technology and Materials)

Research Group

Electronic Components, Technology and Materials

Reliability Multiscale Electromigration Stress evolution Copper interconnects In situ synchrotron X-ray diffraction

To reference this document use:

https://doi.org/10.4233/uuid:1f147f76-5415-4d1d-8b2e-9be18c2cd26c

More Info

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Publication Year

2025

Language

English

Research Group

Electronic Components, Technology and Materials

ISBN (print)

978-94-6384-866-4

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