Multiscale Experimental Investigation of Electromigration Failure in Al &amp; Cu Interconnects

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doi:10.4233/uuid:1f147f76-5415-4d1d-8b2e-9be18c2cd26c

Multiscale Experimental Investigation of Electromigration Failure in Al & Cu Interconnects

Doctoral Thesis (2025)

Author(s)

Y. Zhang (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Contributor(s)

G.Q. Zhang – Promotor (TU Delft - Electrical Engineering, Mathematics and Computer Science)

S. Vollebregt – Promotor (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Research Group

Electronic Components, Technology and Materials

Reliability Multiscale Electromigration Stress evolution Copper interconnects In situ synchrotron X-ray diffraction

DOI related publication

https://doi.org/10.4233/uuid:1f147f76-5415-4d1d-8b2e-9be18c2cd26c Final published version

To reference this document use

https://doi.org/10.4233/uuid:1f147f76-5415-4d1d-8b2e-9be18c2cd26c

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Publication Year

2025

Language

English

Research Group

Electronic Components, Technology and Materials

ISBN (print)

978-94-6384-866-4

Downloads counter

111

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