Creep behavior of a molding compound and its effect on packaging process stresses

Kiasat, MS; Zhang, G.Q.; Ernst, L.J.; Wisse, G.

Creep behavior of a molding compound and its effect on packaging process stresses

Conference paper (2001)

Authors

MS Kiasat Dynamics of Micro and Nano Systems

G.Q. Zhang External organisation

L.J. Ernst Dynamics of Micro and Nano Systems

G. Wisse Dynamics of Micro and Nano Systems

Research Group

Dynamics of Micro and Nano Systems

To reference this document use:

http://resolver.tudelft.nl/uuid:1ff92935-d28c-423b-88db-fa671f874630

More Info

expand_more

Published Date

2001

Language

Undefined/Unknown

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Research Group

Dynamics of Micro and Nano Systems

No files available

Metadata only record. There are no files for this conference paper.