Creep behavior of a molding compound and its effect on packaging process stresses
Conference Paper
(2001)
Author(s)
MS Kiasat (TU Delft - Dynamics of Micro and Nano Systems)
G.Q. Zhang (External organisation)
LJ Ernst (TU Delft - Dynamics of Micro and Nano Systems)
G. Wisse (TU Delft - Dynamics of Micro and Nano Systems)
Research Group
Dynamics of Micro and Nano Systems
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https://resolver.tudelft.nl/uuid:1ff92935-d28c-423b-88db-fa671f874630
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Publication Year
2001
Research Group
Dynamics of Micro and Nano Systems
Pages (from-to)
931-938
ISBN (print)
0-7803-7038-4
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