Fast preparation of ultrathin FIB lamellas for MEMs-based in situ TEM experiments

Conference Paper (2016)
Author(s)

Hui Wang (Beihang University, QN/High Resolution Electron Microscopy)

Shanggang Xiao (Beihang University)

Qiang Xu (DENSsolutions, TU Delft - QN/Zandbergen Lab)

Tao Zhang (Beihang University)

H. Zandbergen (TU Delft - QN/Zandbergen Lab)

Research Group
QN/Zandbergen Lab
DOI related publication
https://doi.org/10.4028/www.scientific.net/MSF.850.722
More Info
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Publication Year
2016
Language
English
Research Group
QN/Zandbergen Lab
Volume number
850
Pages (from-to)
722-727
ISBN (print)
9783038357629

Abstract

The preparation of thin lamellas by focused ion beam (FIB) for MEMS-based in situ TEM experiments is time consuming. Typically, the lamellas are of ~5μm*10μm and have a thickness less than 100nm. Here we demonstrate a fast lamellas’ preparation method using special fast cutting by FIB of samples prepared by conventional TEM sample preparation by argon ion milling or electrochemical polishing methods. This method has been applied successfully on various materials, such as ductile metallic alloy Ti68Ta27Al5, brittle ceramics K0.5Na0.5NbO3-6%LiNbO3 and semiconductor Si. The thickness of the lamellas depends on the original TEM sample.

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