Mechanical design and characterization for MEMS thin-film packaging

Journal article (2011)

Authors

F. Santagata Electronic Components, Technology and Materials - EEMCS
J.J.M. Zaal Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
VG Huerta External organisation
L. Mele Electronic Components, Technology and Materials - EEMCS
J.F. Creemer Electronic Components, Technology and Materials - EEMCS
Pasqualina M Sarro Electronic Components, Technology and Materials - EEMCS
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2011

Language

English

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials