Pressure-assisted CU sintering for SiC Die-attachment application

Liu, X.

doi:10.4233/291baefe-c4b9-46ea-b250-a6c8f4e6ece8

Pressure-assisted CU sintering for SiC Die-attachment application

Doctoral thesis (2023)

Authors

X. Liu Electronic Components, Technology and Materials

Contributors

Guo Qi Zhang Electronic Components, Technology and Materials (promotor)

H Ye Electronic Components, Technology and Materials (copromotor)

Research Group

Electronic Components, Technology and Materials

DOI: https://doi.org/10.4233/uuid:291baefe-c4b9-46ea-b250-a6c8f4e6ece8

Shear Strength Nanoindentation Molecular dynamics Nano Cu sintering Silicon carbide power electronics packaging Mechanical reliability Thermal conductivity Static and dynamic test

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Published Date

2023

Language

English

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Research Group

Electronic Components, Technology and Materials

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