Pressure-assisted CU sintering for SiC Die-attachment application

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doi:10.4233/uuid:291baefe-c4b9-46ea-b250-a6c8f4e6ece8

Pressure-assisted CU sintering for SiC Die-attachment application

Doctoral Thesis (2023)

Author(s)

X. Liu (TU Delft - Electronic Components, Technology and Materials)

Contributor(s)

Guo Qi Zhang – Promotor (TU Delft - Electronic Components, Technology and Materials)

H Ye – Copromotor (TU Delft - Electronic Components, Technology and Materials)

Research Group

Electronic Components, Technology and Materials

Copyright

Shear Strength Nanoindentation Molecular dynamics Nano Cu sintering Silicon carbide power electronics packaging Mechanical reliability Thermal conductivity Static and dynamic test

To reference this document use:

https://doi.org/10.4233/uuid:291baefe-c4b9-46ea-b250-a6c8f4e6ece8

More Info

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Publication Year

2023

Language

English

Copyright

Research Group

Electronic Components, Technology and Materials

ISBN (print)

978-94-6473-018-0

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

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