On-chip actuation for waveguide alignment

Journal article (2018)

Authors

M. Tichem Micro and Nano Engineering - Mechanical, Maritime and Materials Engineering
T.J. Peters Micro and Nano Engineering - Mechanical, Maritime and Materials Engineering
K. Wu Micro and Nano Engineering - Mechanical, Maritime and Materials Engineering
Research Group
Micro and Nano Engineering (Mechanical, Maritime and Materials Engineering) (TU Delft)
Copyright: © 2018 M. Tichem, T.J. Peters, K. Wu
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Published Date

2018

Language

English

Reuse Rights

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Micro and Nano Engineering

Abstract

Recent decades have seen impressive developments in the field of integrated
photonics. Chips with complex photonic functionality can presently be designed
and fabricated. Photonic packages consist of one or more PICs, as well as other
(micro-optical) components, and a fibre (array) to establish the external optical
interface. A core challenge is the assembly and packaging of these complex
devices, involving sub-μm alignment of components. To overcome the
limitations in multi-chip photonic packaging, a concept is proposed which uses
on-chip actuators for the fine-alignment of flexible waveguide structures.