Testing solder interconnect reliabilty under drop impact loading conditions

Conference paper (2007)

Authors

J.J.M. Zaal Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
W.D. van Driel Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
HP Hochstenbach External organisation
Kouchi Zhang Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
Research Group
Computational Design and Mechanics (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2007

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Computational Design and Mechanics