Modeling Electrochemical Migration through Plastic Microelectronics Encapsulations

Conference paper (2009)

Authors

M van Soestbergen Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
A. Mavinkurve External organisation
RTH Rongen External organisation
L.J. Ernst Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
Kouchi Zhang Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
Research Group
Computational Design and Mechanics (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2009

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Computational Design and Mechanics

Abstract

Plastic encapsulations will absorb moisture in humid environments due to their hydrophilic nature, this in combination with the inherent ionic contamination of the plastic will result in an electrolyte. This electrolyte might pose several reliability issues for the package and the encapsulated microelectronic circuit, such as electrochemical migration and bond pad corrosion. The corresponding failure mechanisms are associated with ionic currents through the package and electrochemical processes at e.g. the leads or bond wires. In this paper we present a generic mathematical framework for modeling ionic currents and electrochemical processes. We will apply this framework to electrochemical migration of metal between the leads of a plastic encapsulation, and show results for the transient formation of migration fluxes through the plastic encapsulation.