Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization- difficulties and solution

Conference paper (2014)

Authors

I. Maus External organisation
H Preu External organisation
M Niessner External organisation
H Nabi External organisation
K.M.B. Jansen OLD Product Engineering
R Pantou External organisation
Laurens Weiss External organisation
B. Michel External organisation
B Wunderle External organisation
Research Group
OLD Product Engineering
More Info
expand_more

Published Date

2014

Language

English

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Research Group

OLD Product Engineering