H Nabi

Conference paper (1)

1 records found

Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization- difficulties and solution

Conference paper (2014) - I Maus (author) , H. Preu (author) , M Niessner (author) , H Nabi (author) , K. M.B. Jansen (author) , R Pantou (author) , Laurens Weiss (author) , B Michel (author) , B Wunderle (author)