Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull
Journal Article
(2009)
Author(s)
JJM Zaal (TU Delft - Computational Design and Mechanics)
HP Hochstenbach (External organisation)
Williem van Driel (TU Delft - Computational Design and Mechanics)
Guo Qi Z Zhang (TU Delft - Computational Design and Mechanics)
Research Group
Computational Design and Mechanics
To reference this document use:
https://resolver.tudelft.nl/uuid:3e28aeb2-779c-4a55-9272-c0b887983157
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Publication Year
2009
Research Group
Computational Design and Mechanics
Issue number
2009
Volume number
49
Pages (from-to)
846-852
Abstract
The use of microelectronic components in mobile appliances is constantly increasing. Appliances like mobile phones, PDA's and navigation systems contain more and more functionality and smaller microelectronic components.
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