Wafer-level packaging for rf applications using low-loss spacer substrate for integration of passives
Conference Paper
(2005)
Author(s)
SM Sinaga (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
A Polyakov (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
Marian Bartek (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
Research Group
Old - EWI Ch. Integrated Sensing Devices
To reference this document use:
https://resolver.tudelft.nl/uuid:46e28ccc-0728-4d7f-b457-2e4b066d4412
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Publication Year
2005
Research Group
Old - EWI Ch. Integrated Sensing Devices
Pages (from-to)
-
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