Enabling micro transfer printable SNSPDs for fully integrated quantum photonic platforms
Linus Krämer (University of Heidelberg)
R. Jaha (University of Heidelberg)
C. Graham-Scott (Universität Münster)
I. Luntadila Lufungula (Universiteit Gent)
L. Jin (TU Delft - QuTech Advanced Research Centre, TU Delft - QID/Ishihara Lab)
S. Ferrari (University of Heidelberg)
W. Pernice (University of Heidelberg)
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Abstract
Micro-transfer printing (uTP) facilitates the integration of pre-characterized components from different substrates onto one common carrier die, enabling high-yield processes. Its highly parallel nature allows for exceptional throughput [1]. uTP has been successfully applied to III-V amplifiers, lasers [2], and quantum dot emitters [3], among others.