Wire bonding the future: a combined experimental and numerical approach to improve the Cu-wire bonding quality
E Spaan (External organisation)
E Ooms (External organisation)
W. D. van Driel (TU Delft - Computational Design and Mechanics)
Cadmus Yuan (TU Delft - Computational Design and Mechanics)
D Yang (TU Delft - Computational Design and Mechanics)
GQ Zhang (External organisation)
More Info
expand_more
Abstract
In this paper, the Copper wirebonding technology is investigated. From a numerical point of view, the wirebonding process is modelled. Experiments on specially designed bondpads are performed in order to verify the models. As such, this leads to a thorough understanding of the wirebonding process, especially the forces that take a role during this process.
No files available
Metadata only record. There are no files for this record.