Monolithic three-dimensional stacking of integrated circuits with a low-temperature process
Conference Paper
(2008)
Author(s)
M.R. Tajari Mofrad (TU Delft - Electronic Components, Technology and Materials)
J Derakhshandeh (TU Delft - Electronic Components, Technology and Materials)
Ryoichi Ishihara (TU Delft - Electronic Components, Technology and Materials)
C.I.M. Beenakker (TU Delft - Electronic Components, Technology and Materials)
Research Group
Electronic Components, Technology and Materials
To reference this document use:
https://resolver.tudelft.nl/uuid:5c305ad6-695b-49ff-803d-33c6196509b8
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Publication Year
2008
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
596-599
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