Monolithic three-dimensional stacking of integrated circuits with a low-temperature process

Conference paper (2008)

Authors

M.R. Tajari Mofrad Electronic Components, Technology and Materials - EEMCS
J. Derakhshandeh Kheljani Electronic Components, Technology and Materials - EEMCS
R. Ishihara Electronic Components, Technology and Materials - EEMCS
C.I.M. Beenakker Electronic Components, Technology and Materials - EEMCS
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2008

Language

Undefined/Unknown

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials