Patterning of fine-features in nanoporous films synthesized by spark ablation

Conference paper (2022)

Authors

X. Ji Electronic Components, Technology and Materials - EEMCS
H.J. van Ginkel Electronic Components, Technology and Materials - EEMCS
D. Hu Electronic Components, Technology and Materials - EEMCS
A. Schmidt-Ott ChemE/Materials for Energy Conversion and Storage - AS
H.W. van Zeijl Electronic Components, Technology and Materials - EEMCS
S. Vollebregt Electronic Components, Technology and Materials - EEMCS
Kouchi Zhang Electronic Components, Technology and Materials - EEMCS
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
Copyright: © 2022 X. Ji, H.J. van Ginkel, D. Hu, A. Schmidt-Ott, H.W. van Zeijl, S. Vollebregt, Kouchi Zhang
DOI
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https://doi.org/10.1109/NANO54668.2022.9928705
Nanofabrication Nanoparticle Lift-off Spark ablation Nanoporous film
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Published Date

2022

Language

English

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

Advances in semiconductor device manufacturing technologies are enabled by the development and application of novel materials. Especially one class of materials, nanoporous films, became building blocks for a broad range of applications, such as gas sensors and interconnects. Therefore, a versatile fabrication technology is needed to integrate these films and meet the trend towards device miniaturization and high integration density. In this study, we developed a novel method to pattern nanoporous thin films with high flexibility in material selection. Herein, Au and ZnO nanoparticles were synthesized by spark ablation and printed on a Ti/TiO2 adhesion layer, which was exposed by a lithographic stencil mask. Subsequently, the photoresist was stripped by a cost-efficient lift-off process. Nanoporous patterned features were thus obtained and the finest feature has a gap width of 0.6 μ fm and a line width of 2 μ fm. Using SEM and profilometers to investigate the structure of the films, it was demonstrated that the lift-off process had a minor impact on the microstructure and thickness. The samples presented a rough surface and high porosity, indicating a large surface-to-volume ratio. This is supported by the measured conductivity of Au nanoporous film, which is 12% of the value for bulk Au. As lithographic stencil printing is compatible with conventional lithographic pattering, this method enables further application on mass production of various nanoporous film-based devices in the future.