Patterning of fine-features in nanoporous films synthesized by spark ablation
X. Ji (TU Delft - Electronic Components, Technology and Materials)
H.J. van Ginkel (TU Delft - Electronic Components, Technology and Materials)
Dong Hu (TU Delft - Electronic Components, Technology and Materials)
A. Schmidt-Ott (TU Delft - ChemE/Materials for Energy Conversion and Storage)
H. van Zeijl (TU Delft - Electronic Components, Technology and Materials)
S. Vollebregt (TU Delft - Electronic Components, Technology and Materials)
G. Zhang (TU Delft - Electronic Components, Technology and Materials)
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Abstract
Advances in semiconductor device manufacturing technologies are enabled by the development and application of novel materials. Especially one class of materials, nanoporous films, became building blocks for a broad range of applications, such as gas sensors and interconnects. Therefore, a versatile fabrication technology is needed to integrate these films and meet the trend towards device miniaturization and high integration density. In this study, we developed a novel method to pattern nanoporous thin films with high flexibility in material selection. Herein, Au and ZnO nanoparticles were synthesized by spark ablation and printed on a Ti/TiO2 adhesion layer, which was exposed by a lithographic stencil mask. Subsequently, the photoresist was stripped by a cost-efficient lift-off process. Nanoporous patterned features were thus obtained and the finest feature has a gap width of 0.6 μ fm and a line width of 2 μ fm. Using SEM and profilometers to investigate the structure of the films, it was demonstrated that the lift-off process had a minor impact on the microstructure and thickness. The samples presented a rough surface and high porosity, indicating a large surface-to-volume ratio. This is supported by the measured conductivity of Au nanoporous film, which is 12% of the value for bulk Au. As lithographic stencil printing is compatible with conventional lithographic pattering, this method enables further application on mass production of various nanoporous film-based devices in the future.