On maximizing the compound yield for 3D wafer-to-wafer stacked ICs
Conference Paper
(2010)
Author(s)
M. Taouil (TU Delft - Computer Engineering)
S Hamdioui (TU Delft - Computer Engineering)
J Verbree (External organisation)
E Marinissen (External organisation)
Research Group
Computer Engineering
To reference this document use:
https://resolver.tudelft.nl/uuid:62096aa1-846a-4e7f-aa2e-d7ec4fd38b30
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Publication Year
2010
Language
English
Research Group
Computer Engineering
Pages (from-to)
1-10
ISBN (print)
978-1-4244-7205-5
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