Test cost analysis for 3D die-to-wafer stacking
Conference Paper
(2010)
Author(s)
M. Taouil (TU Delft - Computer Engineering)
S Hamdioui (TU Delft - Computer Engineering)
C.I.M. Beenakker (TU Delft - Electronic Components, Technology and Materials)
E Marinissen (External organisation)
Research Group
Computer Engineering
To reference this document use:
https://resolver.tudelft.nl/uuid:6224d1bf-fe7d-4871-a861-24889c16838e
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Publication Year
2010
Language
English
Research Group
Computer Engineering
Pages (from-to)
435-441
ISBN (print)
978-0-7695-4248-5
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