Impact of various test flows on the cost in 3D die-to-wafer stacking
Conference Paper
(2010)
Author(s)
M. Taouil (TU Delft - Computer Engineering)
S. Hamdioui (TU Delft - Computer Engineering)
E Marinissen (External organisation)
Research Group
Computer Engineering
To reference this document use:
https://resolver.tudelft.nl/uuid:65a2fb7a-553f-4afb-9284-d106136f6724
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Publication Year
2010
Language
English
Research Group
Computer Engineering
Pages (from-to)
1-6
ISBN (print)
978-1-4244-7205-5
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