Reliability of Wafer Level Thin Film MEMS Packages during Wafer Backgrinding
Conference Paper
(2009)
Author(s)
JJM Zaal (TU Delft - Computational Design and Mechanics)
Willem D. van Driel (TU Delft - Computational Design and Mechanics)
GJAM Verheijden (External organisation)
Guo-Qi Zhang (TU Delft - Computational Design and Mechanics)
Research Group
Computational Design and Mechanics
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Publication Year
2009
Research Group
Computational Design and Mechanics
Pages (from-to)
679-683
ISBN (print)
978-1-4244-4659-9
Abstract
With the ever-growing number of MEMS resonator applications, a research effort is required. One important step to consider in the design and evaluation phase is the packaging of such a resonator.
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