Metallic Nanoparticle Sintering for High Density Interconnect

Abstract

As integrated circuits (ICs) become increasingly miniaturized, traditional solder-based interconnects face challenges related to their thermal and mechanical performance, limiting their reliability in high-density applications. This thesis addresses the growing demands of the microelectronics industry, particularly in advanced semiconductor packaging technologies, by focusing on the development of innovative interconnect methods using metallic nanoparticles, specifically copper (Cu). The research aims to overcome these limitations by utilizing copper nanoparticle (CuNP) paste to achieve direct copper-to-copper (Cu-to-Cu) bonding through nanoparticle sintering. This technique is essential for enabling next-generation 2.5D and 3D IC architectures, which require dense interconnects for improved performance...