Packaging induced die stresses considering time-dependent behaviour of a molding compound
Conference Paper
(2001)
Author(s)
JHJ Janssen (External organisation)
G.Q. Zhang (External organisation)
L.J. Ernst (TU Delft - Dynamics of Micro and Nano Systems)
MS Kiasat (TU Delft - Dynamics of Micro and Nano Systems)
. al. (External organisation)
Research Group
Dynamics of Micro and Nano Systems
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https://resolver.tudelft.nl/uuid:6e85dede-23f9-4ae6-b3ec-b6e350ac0deb
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Publication Year
2001
Research Group
Dynamics of Micro and Nano Systems
Pages (from-to)
227-231
ISBN (print)
0-7803-9806-8
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