Packaging induced die stresses considering time-dependent behaviour of a molding compound

Janssen, JHJ; Zhang, G.Q.; Ernst, L.J.; Kiasat, MS; al., et.

Packaging induced die stresses considering time-dependent behaviour of a molding compound

Conference paper (2001)

Authors

JHJ Janssen External organisation

G.Q. Zhang External organisation

L.J. Ernst Dynamics of Micro and Nano Systems

MS Kiasat Dynamics of Micro and Nano Systems

et. al. External organisation

Research Group

Dynamics of Micro and Nano Systems

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Published Date

2001

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Research Group

Dynamics of Micro and Nano Systems

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