Novel system-in-package design and packaging solution for solid state lighting systems
Conference Paper
(2014)
Author(s)
Mingzhi Dong (TU Delft - Electronic Components, Technology and Materials)
Fabio Santagata (TU Delft - Electronic Components, Technology and Materials)
J. Wei (TU Delft - Electronic Components, Technology and Materials)
C Yuan (External organisation)
Guo Qi Zhang (TU Delft - Electronic Components, Technology and Materials)
Research Group
Electronic Components, Technology and Materials
DOI related publication
https://doi.org/10.1109/ECTC.2014.6897442
To reference this document use:
https://resolver.tudelft.nl/uuid:77f357ed-fb16-4b64-b040-ccdee56135e1
More Info
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Publication Year
2014
Language
English
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
1192-1197
ISBN (print)
978-147992407-3
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