Establishing fracture properties of EMC-copper (-oxide) interfaces

Conference paper (2009)

Authors

L.J. Ernst Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
A. Xiao Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
J de Vreugd Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
K.M.B. Jansen Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
H Pape External organisation
G. Schlottig Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
B Wunderle External organisation
Research Group
Computational Design and Mechanics (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2009

Language

English

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Computational Design and Mechanics

Abstract

Interfacial delamination has become one of the key reliability issues in the microelectronics of portable devices and therefore is getting more and more attention. The analysis of delamination of a laminate structure with a crack along the interface is central to the characterization of interfacial toughness. Due to the mismatch in mechanical properties of the materials adjacent to the interface and also possible asymmetry of loading and geometry, usually the delamination propagates under mixed mode conditions. In this study, a modified mixed mode bending test using production line interface samples is proposed. The critical fracture properties are obtained by interpreting the experimental results through dedicated finite element modeling. The interface types being considered in the present work are between EMC's and copper lead frame.

Keywords-fracture; delamination; testing