Indentation hardness, plasticity and initial creep properties of nanosilver sintered joint
Hao Zhang (Harbin University of Science and Technology, TU Delft - Electronic Components, Technology and Materials)
Y. Liu (TU Delft - Electronic Components, Technology and Materials, Harbin University of Science and Technology)
Lingen Wang (Boschman Technologies)
Fenglian Sun (Harbin University of Science and Technology)
Xue-Jun Fan (Lamar University)
Guo Qi Zhang (TU Delft - Electronic Components, Technology and Materials)
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Abstract
The nanoindentation test was conducted in this paper to investigate the indentation hardness, plasticity and initial creep properties of pressure sintered nanosilver joint at various test temperatures. The effects of strain rate on the indentation hardness were first investigated. Then yield stress of nanosilver sintered joint was studied in various pressures sintered joints and the corresponding plastic stress-strain constitutive equations were gained. The maximum indentation depth of nanosilver sintered joint was obviously affected by the test temperature and sintering pressure. The indentation hardness of nanosilver sintered joint decreased with increasing test temperature from 140 to 200°C, which can be attributed to the increased amount of thermal vacancies at high temperatures. However, the indentation modulus exhibited decrease trend as the temperature increased. It is suggested that the distance between adjacent atoms was enlarged at elevated temperatures and furtherly resulted in the decrease of indentation modulus. In addition, the increased sintering pressure from 5 to 30 MPa improved the indentation hardness and modulus of sintered joint. The initial creep was observed in nanosilver sintered joint at temperatures ranged from 140 to 200°C. The increase of sintering pressure improved the resistance to creep of nanosilver sintered joint.