Study and Application of Nano Copper Sintering Technology in Power Electronics Packaging

Abstract

Nano-metal sintering has been proven to be a promising die attachment technology for power electronics packaging in the high-end application. Compared with nano silver technology, it is believed that copper-based sintering technology has better cost and performance superiority, and thus has more potential to be utilized in the industry in the future. However, most of the current developed nano copper sintering material and technology shows bad performance with high sintering energy input. In this study, a novel nano-copper based paste has been developed with excellent process ability (sinterable below 280°C for 10 min with low pressure assisted) and good material property (over 40 MPa shear strength), which turns out to be suitable for the state-of-the-art packaging process. Then the material was applied into a SiC power module packaging scenario which shows comparable performance as silver sintering. The whole process only consumed less than 0.5h for each batch, which indicates that the copper sintering technology has great potential for the packaging application in high power situation.