Study and Application of Nano Copper Sintering Technology in Power Electronics Packaging

Conference paper (2021)

Authors

X. Liu Electronic Components, Technology and Materials - EEMCS
Quan Zhou Chongqing University
Xu Zhao Shenzhen Institute of Wide-bandgap Semiconductors
Sau Wee Koh Huawei Technology
H. Ye Shenzhen Institute of Wide-bandgap Semiconductors, Southern University of Science and Technology
Kouchi Zhang Electronic Components, Technology and Materials - EEMCS
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
Nano Cu sintering Shear strength Thermal behavior Power electronics packaging Reliability performance
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Published Date

2021

Language

English

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

Nano-metal sintering has been proven to be a promising die attachment technology for power electronics packaging in the high-end application. Compared with nano silver technology, it is believed that copper-based sintering technology has better cost and performance superiority, and thus has more potential to be utilized in the industry in the future. However, most of the current developed nano copper sintering material and technology shows bad performance with high sintering energy input. In this study, a novel nano-copper based paste has been developed with excellent process ability (sinterable below 280°C for 10 min with low pressure assisted) and good material property (over 40 MPa shear strength), which turns out to be suitable for the state-of-the-art packaging process. Then the material was applied into a SiC power module packaging scenario which shows comparable performance as silver sintering. The whole process only consumed less than 0.5h for each batch, which indicates that the copper sintering technology has great potential for the packaging application in high power situation.