Electromagnetic-Thermal Performance Trade-Offs in Phased Arrays with Shaped Elevation Patterns
F.T. Çelik (TU Delft - Microwave Sensing, Signals & Systems)
C. Zhao (TU Delft - Microwave Sensing, Signals & Systems)
A. Yarovoy (TU Delft - Microwave Sensing, Signals & Systems)
Yanki Aslan (TU Delft - Microwave Sensing, Signals & Systems)
More Info
expand_more
Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.
Abstract
Both thermal and electromagnetic performance of substrate-integrated waveguide (SIW) and microstrip line-fed shaped-beam arrays with slot and patch radiating elements are conducted. Three array types operating at 26 GHz band, namely SIW slot array, SIW array with patches, and proximity coupled patch array, are considered. The array performances regarding shaped radiation pattern stability with frequency and maximal temperature at the power amplifier chips are discussed. The study highlights intriguing trade-offs between radiation pattern performance and cooling ability in phased arrays.