Thermal-Aware Channel Capacity
Yeow Meng Chee (National University of Singapore)
Tuvi Etzion (Technion Israel Institute of Technology)
Kees A. Schouhamer Immink (Turing Machines Inc.)
Tuan Thanh Nguyen (Singapore University of Technology and Design)
Van Khu Vu (National University of Singapore)
Jos Weber (TU Delft - Discrete Mathematics and Optimization)
Eitan Yaakobi (Technion Israel Institute of Technology)
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Abstract
High temperatures in electronic devices have a negative effect on their performance. Various techniques have been proposed and studied to address and combat this thermal challenge. To guarantee that the peak temperature of the devices will be bounded by some maximum temperature, the transmitted signal has to satisfy some constraints.With this motivation, we study the constrained channel that only accepts sequences that satisfy prescribed thermal constraints. The main goal in this paper is to compute the capacity of this channel. We provide the exact capacity of the channel with some certain parameters and we also present some bounds on the capacity in various cases.Finally, we consider the model that multiple wires are available to use and find out the smallest number of wires required to satisfy the thermal constraints.