Thermal-Aware Channel Capacity

Conference paper (2023)

Authors

Yeow Meng Chee National University of Singapore
Tuvi Etzion Israel Institute of Technology
Kees A. Schouhamer Immink Turing Machines Inc.
Tuan Thanh Nguyen Singapore University of Technology and Design
Van Khu Vu National University of Singapore
J.H. Weber Discrete Mathematics and Optimization - EEMCS
Eitan Yaakobi Israel Institute of Technology
Research Group
Discrete Mathematics and Optimization (EEMCS) (TU Delft)
Copyright: © 2023 Yeow Meng Chee, Tuvi Etzion, Kees A. Schouhamer Immink, Tuan Thanh Nguyen, Van Khu Vu, J.H. Weber, Eitan Yaakobi
DOI: https://doi.org/10.1109/ISIT54713.2023.10206738
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Published Date

2023

Language

English

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Delft Institute of Applied Mathematics

Research Group

Discrete Mathematics and Optimization

Abstract

High temperatures in electronic devices have a negative effect on their performance. Various techniques have been proposed and studied to address and combat this thermal challenge. To guarantee that the peak temperature of the devices will be bounded by some maximum temperature, the transmitted signal has to satisfy some constraints.With this motivation, we study the constrained channel that only accepts sequences that satisfy prescribed thermal constraints. The main goal in this paper is to compute the capacity of this channel. We provide the exact capacity of the channel with some certain parameters and we also present some bounds on the capacity in various cases.Finally, we consider the model that multiple wires are available to use and find out the smallest number of wires required to satisfy the thermal constraints.