Interconnect Networks for Resistive Computing Architectures

Conference Paper (2017)
Author(s)

Hoang Anh Du Nguyen (TU Delft - Computer Engineering)

Lei Xie (TU Delft - Computer Engineering)

Jintao Yu (TU Delft - Computer Engineering)

Mottaqiallah Taouil (TU Delft - Computer Engineering)

Said Hamdioui (TU Delft - Computer Engineering)

Research Group
Computer Engineering
DOI related publication
https://doi.org/10.1109/DTIS.2017.7929872 Final published version
More Info
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Publication Year
2017
Language
English
Research Group
Computer Engineering
Pages (from-to)
1-6
ISBN (print)
978-1-5090-6378-9
ISBN (electronic)
978-1-5090-6377-2
Event
2017 12th International Conference on Design & Technology of Integrated Systems In Nanoscale Era (DTIS) (2017-04-04 - 2017-04-06), Palma de Mallorca, Spain
Downloads counter
127

Abstract

Today's computing systems suffer from a memory/communication bottleneck, resulting in high energy consumption and saturated performance. This makes them inefficient in solving data-intensive applications at reasonable cost. Computation-In-Memory (CIM) architecture, based on the integration of storage and computation in the same physical location using non-volatile memristor crossbar technology, offers a potential solution to the memory bottleneck. An efficient interconnect network is essential to maximize CIM's architectural performance. This paper presents three interconnect network schemes for CIM architecture; these are (1) CMOS-based, (2) memristor-based and (3) hybrid cmos/memristor interconnect network scheme. To illustrate the feasibility of such schemes, a CIM parallel adder is used as a case study. The results show that the hybrid interconnect network scheme achieves a higher performance in comparison with the CMOS-based and memristor-based interconnect scheme in terms of delay, energy and area.