Effects of silicon via profile on passivation and metallization in TSV interposers for 2.5D integration
Journal Article
(2015)
Author(s)
P. Lin (TU Delft - Electronic Components, Technology and Materials)
Guo Qi Z Zhang (TU Delft - Electronic Components, Technology and Materials)
Henk W. van Zeijl (TU Delft - Electronic Components, Technology and Materials)
BH Lian (External organisation)
Y Wang (External organisation)
QB Yao (External organisation)
Research Group
Electronic Components, Technology and Materials
DOI related publication
https://doi.org/10.1016/j.mee.2015.01.008
To reference this document use:
https://resolver.tudelft.nl/uuid:9028a11d-4c00-44f1-b8c0-5a710ed3e5d1
More Info
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Publication Year
2015
Language
English
Research Group
Electronic Components, Technology and Materials
Volume number
134
Pages (from-to)
22-26
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