Prediction and verification of process-induced thermal deformation of electronic packages using non-linear FEM and 3D interferometry

van Driel, WD; Zhang, GQ; Janssen, J.; Ernst, LJ; Su, F; Yi, S

Prediction and verification of process-induced thermal deformation of electronic packages using non-linear FEM and 3D interferometry

Conference paper (2002)

Authors

WD van Driel External organisation

GQ Zhang External organisation

J. Janssen External organisation

LJ Ernst Dynamics of Micro and Nano Systems

F Su External organisation

S Yi External organisation

Research Group

Dynamics of Micro and Nano Systems

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Published Date

2002

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Research Group

Dynamics of Micro and Nano Systems

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