Prediction and verification of process-induced thermal deformation of electronic packages using non-linear FEM and 3D interferometry

Conference Paper (2002)
Author(s)

WD van Driel (External organisation)

GQ Zhang (External organisation)

J. Janssen (External organisation)

Leo Ernst (TU Delft - Dynamics of Micro and Nano Systems)

F Su (External organisation)

S Yi (External organisation)

Research Group
Dynamics of Micro and Nano Systems
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Publication Year
2002
Research Group
Dynamics of Micro and Nano Systems
Pages (from-to)
362-368
ISBN (print)
0-7803-9819-X

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