Prediction and verification of process-induced thermal deformation of electronic packages using non-linear FEM and 3D interferometry

Conference paper (2002)

Authors

WD van Driel External organisation
GQ Zhang External organisation
J. Janssen External organisation
L.J. Ernst Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
F Su External organisation
S Yi External organisation
Research Group
Dynamics of Micro and Nano Systems (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2002

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Dynamics of Micro and Nano Systems