Prediction and verification of process-induced thermal deformation of electronic packages using non-linear FEM and 3D interferometry
Conference Paper
(2002)
Author(s)
WD van Driel (External organisation)
GQ Zhang (External organisation)
J. Janssen (External organisation)
Leo Ernst (TU Delft - Dynamics of Micro and Nano Systems)
F Su (External organisation)
S Yi (External organisation)
Research Group
Dynamics of Micro and Nano Systems
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https://resolver.tudelft.nl/uuid:91ff2c06-c25e-4093-9957-bcb243c553c1
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Publication Year
2002
Research Group
Dynamics of Micro and Nano Systems
Pages (from-to)
362-368
ISBN (print)
0-7803-9819-X
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