Probe design for high-precision eddy-current displacement sensors

Conference Paper (2018)
Author(s)

Johan G. Vogel (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Vikram Chaturvedi (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Stoyan Nihtianov (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Research Group
Electronic Instrumentation
DOI related publication
https://doi.org/10.1109/IECON.2018.8591562 Final published version
More Info
expand_more
Publication Year
2018
Language
English
Research Group
Electronic Instrumentation
Article number
8591562
Pages (from-to)
4877-4883
ISBN (electronic)
978-150906684-1
Event
44th Annual Conference of the IEEE Industrial Electronics Society, IECON 2018 (2018-10-20 - 2018-10-23), Washington, United States
Downloads counter
140

Abstract

State-of-the-art industrial Eddy-Current Displacement Sensors (ECDSs) are typically not suitable for use in high-precision applications due to their low resolution and poor stability. By using a smaller, flat sensing coil, a reference coil, a dedicated readout chip and by operating at much higher excitation frequency a higher measurement sensitivity and better mechanical and thermal stability can be achieved. To use the sensor in industrial applications, the chip and the coils must be integrated in a small package. This paper presents a probe design for a high-precision ECDS, aiming at compactness and low thermal sensitivity. In this design, the sensing coil and the reference coil are closely spaced to minimise thermal gradients. The coils can, together with intermediate shielding and capacitive tilt electrodes, be integrated into a single stack only 2 mm thick and 12 mm in diameter, which can be realised on a multilayer PCB. Thermomechanical modelling shows that placing the readout chip on a separate PCB leads to significantly decreased self-heating compared to placement directly on the stack. Experiments show that the inductance behaviour of the realised stack is similar to that of the model.