Micromechanical modeling of stress evolution induced during cure in a particle-filled electronic packaging polymer
Conference Paper
(2003)
Author(s)
D Yang (TU Delft - Dynamics of Micro and Nano Systems)
K. M.B. Jansen (TU Delft - Dynamics of Micro and Nano Systems)
L Wang (TU Delft - Electronic Components, Technology and Materials)
LJ Ernst (TU Delft - Dynamics of Micro and Nano Systems)
GQ Zhang (External organisation)
HJL Bressers (External organisation)
Research Group
Dynamics of Micro and Nano Systems
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https://resolver.tudelft.nl/uuid:9ba57a88-b0f0-4052-9b27-01e57f35ef37
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Publication Year
2003
Research Group
Dynamics of Micro and Nano Systems
Pages (from-to)
57-62
ISBN (print)
0-7803-7054-6
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