Micromechanical modeling of stress evolution induced during cure in a particle-filled electronic packaging polymer

Conference paper (2003)

Authors

D Yang Dynamics of Micro and Nano Systems
Kaspar M B Jansen Dynamics of Micro and Nano Systems
L Wang Electronic Components, Technology and Materials
L.J. Ernst Dynamics of Micro and Nano Systems
GQ Zhang External organisation
HJL Bressers External organisation
Research Group
Dynamics of Micro and Nano Systems
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Published Date

2003

Language

Undefined/Unknown

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Research Group

Dynamics of Micro and Nano Systems

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