Characterization of moisture properties of polymers for IC packaging

Journal article (2007)

Authors

X. Ma Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
K.M.B. Jansen Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
L.J. Ernst Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
W.D. van Driel Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
O van der Sluis Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
Kouchi Zhang Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
Research Group
Computational Design and Mechanics (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2007

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Computational Design and Mechanics

Abstract

In this paper we determined the water uptake of a die attach and a molding compound. The two types of polymer which were selected are a die attach filled with silver particles and an epoxy molding compound filled with silica particles. The water absorption is carried out in an adjustable thermal and humidity chamber, SGA-100, at different temperatures and humidity levels. Moisture absorption equilibrium of test data were obtained by experiment. The moisture absorption equilibrium prediction equation was modeled by using the extrapolated experimental data. Diffusion coefficients at different temperature were obtained from the moisture absorption experiments.