Fast etching of molding compound by an Ar/O2/CF4 plasma and process improvements for semiconductor package decapsulation

Tang, J.; Gruber, D; Schelen, JBJ; Funke, H-J; Beenakker, C.I.M.

Fast etching of molding compound by an Ar/O2/CF4 plasma and process improvements for semiconductor package decapsulation

Journal article (2012)

Authors

J. Tang Electronic Components, Technology and Materials

D Gruber External organisation

JBJ Schelen External organisation

H-J Funke External organisation

C.I.M. Beenakker Electronic Components, Technology and Materials

Research Group

Electronic Components, Technology and Materials

To reference this document use:

http://resolver.tudelft.nl/uuid:a2d1f56e-c838-4026-b56d-fb023bfac2da

More Info

expand_more

Published Date

2012

Language

English

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Research Group

Electronic Components, Technology and Materials

No files available

Metadata only record. There are no files for this journal article.