Fast etching of molding compound by an Ar/O2/CF4 plasma and process improvements for semiconductor package decapsulation
Journal Article
(2012)
Author(s)
J. Tang (TU Delft - Electronic Components, Technology and Materials)
D Gruber (External organisation)
JBJ Schelen (External organisation)
H-J Funke (External organisation)
C.I.M. Beenakker (TU Delft - Electronic Components, Technology and Materials)
Research Group
Electronic Components, Technology and Materials
DOI related publication
https://doi.org/10.1149/2.019204jss
To reference this document use:
https://resolver.tudelft.nl/uuid:a2d1f56e-c838-4026-b56d-fb023bfac2da
More Info
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Publication Year
2012
Language
English
Research Group
Electronic Components, Technology and Materials
Issue number
4
Volume number
1
Pages (from-to)
175-178
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