Characterization of waferstepper and process related front- to backwafer overlay errors in bulk micro machining using electrical overlay test structures
Conference Paper
(2004)
Author(s)
H.W. van Zeijl (TU Delft - Electronic Components, Technology and Materials)
FGC Bijnen (External organisation)
J Slabbekoorn (TU Delft - Electronic Components, Technology and Materials)
Research Group
Electronic Components, Technology and Materials
To reference this document use:
https://resolver.tudelft.nl/uuid:a2edf032-d956-4472-8b79-00d45270316a
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Publication Year
2004
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
398-406
ISBN (print)
0-8194-5378-1
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