A micromachining post-process module with pattern transfer in deep cavities for RF silicon technology
Conference Paper
(2001)
Author(s)
PN Pham (TU Delft - Electronic Components, Technology and Materials)
Lina Sarro (TU Delft - Electronic Components, Technology and Materials)
TK Ng (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
JN Burghartz (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
Research Group
Electronic Components, Technology and Materials
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https://resolver.tudelft.nl/uuid:a5e99dbc-1d6b-4440-a3df-7af47212fd0a
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Publication Year
2001
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
345-348
ISBN (print)
0-7803-5998-4
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