Junction temperature measurement to optimize thermal design of LED arrays

Conference paper (2015)

Authors

H. Ye Electronic Components, Technology and Materials - EEMCS , Chinese Academy of Sciences
H. Tang Changzhou Institute of Technology Research for Solid State Lighting, Electronic Components, Technology and Materials - EEMCS
Stanley Y.Y. Leung Changzhou Institute of Technology Research for Solid State Lighting
Cheng Qian Chinese Academy of Sciences
Xuejun Fan Lamar University
Kouchi Zhang Electronic Components, Technology and Materials - EEMCS
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
Light emitting diodes Phosphors Temperature measurement Temperature distribution Junctions Heat sinks
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Published Date

2015-11

Language

English

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

The drive to increase electrical currents input, and to achieve high lumen output for High Brightness Light Emitting Diode (HB LED) has led to a series of thermal problems. Hence, thermal management is one of key design parameters as the temperature directly affecting the maximum light output, quality, reliability and life time. For LED arrays, the arrangement of chips will affect the thermal performance and junction temperature is very important in the design. However, because direct junction temperature determination is hard to detect due to the encapsulation, indirect methods are more preferred. Among them, the diode forward-voltage method is the most accurate one. Therefore, we used the diode forward-voltage method to optimize thermal design of LED arrays in this work.