Impact of Thermal Aging on the Dielectric Properties and Breakdown Strength of Perfluoroalkoxy (PFA) Insulated High-Voltage Cables for Hybrid/Electric Aircraft

Conference Paper (2026)
Author(s)

J. Ahmad (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Jineeth Joseph (GKN Fokker)

Michel de Jongh (GKN Fokker)

P.T.M. Vaessen (TU Delft - Electrical Engineering, Mathematics and Computer Science)

M. Ghaffarian Niasar (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Research Group
High Voltage Technology Group
DOI related publication
https://doi.org/10.1109/ICD64907.2026.11665199 Final published version
More Info
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Publication Year
2026
Language
English
Research Group
High Voltage Technology Group
Pages (from-to)
809-812
Publisher
IEEE
ISBN (print)
979-8-3315-3493-6
ISBN (electronic)
979-8-3315-3492-9
Event
2026 IEEE 6th International Conference on Dielectrics (ICD) (2026-06-21 - 2026-06-27), Southampton, United Kingdom
Page Views
14
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Abstract

The increasing adoption of hybrid and electric aircraft calls for the development of high-voltage cabling systems with superior thermal endurance and dielectric reliability. Understanding their aging behavior is essential for long-term performance in extreme environments. This study investigates the impact of thermal aging on the dielectric properties and breakdown strength of perfluoroalkoxy (PFA) insulated aircraft cables. Thermal aging tests were conducted which include exposing aircraft cables to a thermal aging profile for up to 500 h at 280° C. The dielectric properties, including relative permittivity, dielectric loss tangent $(\boldsymbol{{tan}} \boldsymbol{\delta})$, and volume resistivity, were measured at room temperature using the Novocontrol Concept 80 broadband dielectric analyzer over a frequency range of $\mathbf{1 0}^{\mathbf{- 1}} \mathbf{1 \mathbf { 0 } ^ { \mathbf { 6 } }}$ Hz. For AC breakdown strength evaluation, PFA insulation samples were tested under three electrode configurations: sphere-plane, sphere-sphere, and plane-plane. The results indicate that exposure to the thermal profile up to 500 h leads to a gradual decrease in relative permittivity and dielectric loss, accompanied by a noticeable increase in volume resistivity and a slight improvement in dielectric breakdown strength for all electrode configurations. This trend shall be attributed to the structural relaxation and annealing-like stabilization within the semicrystalline PFA matrix which may occur during the initial stages of thermal aging and leads to improved dielectric performance. Further investigations of long-term aging behavior and degradation mechanisms will be conducted in future work to better understand insulation lifetime under prolonged thermal stress.

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