On the use of high precision electrical resistance measurement for analyzing the damage development during accelerated test of Pb-free solder interconnects
Conference Paper
(2013)
Author(s)
J. Zhang (TU Delft - Electronic Components, Technology and Materials)
Sybrand van der Zwaag (TU Delft - Novel Aerospace Materials)
Henk van Zeijl (TU Delft - Electronic Components, Technology and Materials)
Guo Qi Zhang (TU Delft - Electronic Components, Technology and Materials)
Research Group
Electronic Components, Technology and Materials
DOI related publication
https://doi.org/10.1109/ECTC.2013.6575571
To reference this document use:
https://resolver.tudelft.nl/uuid:ac626bce-d183-4151-82da-f365e53feb36
More Info
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Publication Year
2013
Language
English
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
192-199
ISBN (print)
978-1-4799-0233-0
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