Assessment of RDL Technology at Sub-THz Frequencies
C. Tadolini (TU Delft - Electrical Engineering, Mathematics and Computer Science)
T. Verduci (Chip Integration Technology Center, TNO)
E. Sopubekova (TNO, Chip Integration Technology Center)
F. Chiappini (TNO, Chip Integration Technology Center)
S. Monni (TNO)
P.M. Sberna (TU Delft - Electrical Engineering, Mathematics and Computer Science)
M. Spirito (TU Delft - Electrical Engineering, Mathematics and Computer Science)
N. Llombart (TU Delft - Electrical Engineering, Mathematics and Computer Science)
M. Alonso Del Pino (TU Delft - Electrical Engineering, Mathematics and Computer Science)
More Info
expand_more
Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.
Abstract
This contribution presents the assessment of RDL technology at sub-terahertz frequencies based on polybenzoxazole (PBO) polymers. A stack of two PBO layers of 10μm thickness with 3 metallization of 5μm copper is being under development. Vias as small as 10μm and a separation of 60μm are being explored. To assess the materials and capabilities of this technology, GCPW, stripline transmission line structures are being assessed, expecting losses in the order of 1.3dB/mm and 2.1dB/mm respectively. Moreover, two resonators have been designed to enhance the accuracy of the characterization.
Files
File under embargo until 14-07-2026